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Electroplating intermediates for Nickel/Cu/Zn plating

Inquiry
  Post Date: Apr 23,2019
  Expiry Date: Apr 22,2020
  Detailed Description: Specs:ALS, ATP, BBI, PME,TCA
Payment Method: T/T or Irrevocable sight L/C
We produce the following
Electroplating intermediates:
1).Electroplating intermediates
for Ni Plating: BBI, PME, BEO,
TCA, PAP, BMP, PPS-OH, ATP, ATPN,
BOZ, PPS,PN, SSO3, PPS, POPDH,
PS , DEP ,TC-DEP ,EHS,TC-EHS,ALS,
PABS

2)).Electroplating intermediates
for Zn Plating: IME,BPC,TC-BAR,
MOME,BPE ,OCBA,IMIDAZOLE

3). Electroplating intermediates
for Cu Plating: SPS ,MPS, EDTP,
JPH, DPS, UPS, ZPS

We can offer high quality
products, most competitive
prices,
on-time delivery, as well as
necessary technical service
support. If you are interested in
our products, please contact me
by
jane@brightchemical.com.cn.


  Company: Wuhan Bright Chemical Co., Ltd.     [ China ]        
  Contact: Jane Chou
  Tel: 86-27-85583315
  Fax: 86-27-85804899
  Email: jane@brightchemical.com.cn
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