Epoxy resin potting compounds WOC-87-II(A)/113-1(B)
Inquiry
| Post Date: | Jul 06,2019 |
| Expiry Date: | Jul 05,2020 |
| Detailed Description: |
-DescriptionTwo-component encapsulating system based on epoxy resin,formed from auxiliaries including epoxy resin, diluent, compound amine, cross-linking agent and defoamer by special production processing Excellent of the surface gloss of the cured epoxy resin, High/Low temperature resistance is good, excellent electrical properties and have flame retardant property. -ApplicationsEncapsulation of electrical components of Capacitor, Igniter, Transformer, trigger and Filter. -General propertiesTest ItemTest Mothed/ConditionsWOC-87-II A113-1 BAppearanceVisualizationBlack viscous liquidDark brown liquidDensity25ºC g/m³1.58–1.701.0–1.15Viscosity40ºC mpa.s1000 - 500020 - 80Viscosity(blended)40ºC mpa.s 500Storage validitySealed and storage Temp.below 25ºC 6 months 6 monthsRatio of blendWeight/Weight10020-25Curing conditionºC/hrs25ºC/24h -Characteristics after curingItemUnit/ConditionsWOC-87-II A/113-1 BHardness20ºC Shore-D≥70Insulation Strength25ºC kv/mm≥18Bending StrengthKg/cm2≥82High Temperature Resistance150ºC Not cracking after 5 hours Flame RetardancyUL 94V0 or V1Surface Resistance25ºCΩ.cm＞1014Volume Resistance25ºCΩ.cm＞1015Curing Shrinkage Rate%＜0.6 |
| Company: | Yixing Pulitai Electronic Materials Co.,Ltd. [ China ] |
| Contact: | James |
| Tel: | 0510-87903121 |
| Fax: | |
| Email: | james91555@163.com |
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