COG bonding machines COG bonder machine COG bonder machines

• Post Date:

  Dec 03,2014

• Expiry Date:

  Dec 03,2015

• Detailed Description:

  Quantity: 100
  Specs:XCG93-C1
  Price:1 USD Metric Tons
  
  COG bonding machine for IC etc
  COG bonding machine XCG93-C1,
  bonding machines ,
  bonding machine,
  COG bonding machines ,
  COG bonder machine ,
  COG bonder machines,
  
  
  1.About the application field of COG bonding machine XCG93-C1(the pressure).
  COG bonding equipment (the pressure) is widely used in a variety of LCD display (LCD), modules (LCM) and large-sized display panel production, assembly, maintenance, production enterprises; such as. mobile phones, laptops, LCD monitors, tablet PCs, LCD / LCM production, assembly, repair enterprises.
  2.Basic parameters of XCQ77-A1
  Input Power. AC220V 50-60HZ
  Vacuum control. vacuum + vacuum generator;
  Dimensions. L1000 * W1050 * H1475mm (excluding warning lights)
  Operating modes. 7-inch HMI
  Control system (LG-LS). a programmable processor
  Pressure gauge. KITA, the number of explicit
  Pressure regulator. Japan SMC, precision pressure regulating valve
  Pressure accuracy. ± 0.5% full in the degree
  Sensitivity. 0.2% full in the degree
  Pressure Unit. Kg / N / Mpa / Kpa swap
  counterpoint mode. CCD next counterpoint
  Platform Work. Fixed
  Platform Material. high quality Bakelite
  Heating. heating thermostat
  Thermocouple. K type
  Blade material. 440C
  Temperature range. RT-500
  
  
  

• Company:

  Shenzhen Sunsom automatic equipment Co.,Ltd .     [ China ]        

• Contact:

  sunny

• Tel:

  +86-571-12345678

• Fax:

  +86-755-29960795

• Email:

  sunny@sunsom.cn