Coating material high Purity Cu sputtering Copper target
      
      
      	
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Post Date:
      			Jan 16,2017
      		 
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Expiry Date:
      			Jan 16,2018
      		 
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Detailed Description:
      			
      				Cas No. :7440-50-8
			        Quantity: 1Kilograms 
			        Specs:Cu target size customized
			        Price:80 USD Kilograms
			        Payment Method: T/T,L/C,Paypal,WestUnion
			        Iterm name: coating material high Purity Dia 25 mm Cu Copper target
Shape: Square/Round, according to your request
Available size: Round: dia 25~350mm
                Rectangular: length up to 1500mm
                Customization is available
Certificates: ISO9001:2008, SGS, the third test report
Technics: vacuum melting, Patented thermo-mechanical process
Application: widely used in coating processing industries
 
             a: architectural glass, car using glass, graphic display field.
             b:electronic and semiconductor field.
             c:decoration and mould field.      
             d:advanced Packing Application
Advantages:Microstructure:Uniform equiaxed fine grain,consistent microstructure,average grain size <50μm
Sputtering Targets: Ceramic Targets, Metal Targets, Custom-made Targets
Evaporation Materials: Metals Pellets, Oxide Granules
High pure Metals: Targets, Pellet, Wires, Foils
Target Boning Service: Indium, Copper backing plate
Janice Guan
Loyal Target Technology Co., Limited
sales@loyaltarget.com
Tel: +86 10 6292 6252
www.loyaltarget.com
					  
      		 
      		  
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CAS Registry Number:
      			
      				
      					7440-50-8
      				
      			
      		 
      		
      		
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Synonyms:
      			;C.I. 77400;C.I. Pigment Metal 2;Copper;copper coating quality balzers;Copper ingot;raney-copper ready for use;Raney-Copper;Copperpowderdendritic;CopperrodNmmdiacElectrolytic copperagcm;CoppershotNmmdia;CopperturningsN;CopperfoilNmmthickxmmwide;Copperwireclothmeshmmwidemmwiredia;Copperwiremmdia;Copperwiresreducedfromoxide;CopperpowderNmesh;Copperpowdersphericalmesh;Copperpowdermeshunderargon;CopperwireNmmdia;CopperfoilNmmthick;CoppershotNmm;Copper powder;Copper, small rods for elemental analysis;Copper (S, P);Electrolytic tough pitch copper (O);Copper (O);Continuous cast copper (O);Electrolytic copper (trace elements);Copper with added impurities (trace elements);Copper foil(99.9%);Copper wire (99.99) 0.25mm dia.;Bronze, powder;Copper wire (99.999%) 0.76mm dia.;Copper wire cloth;Copper foil (99.9985%);Copper foil(99%);Copper shot(99.9) 1-10mm;Copper shot(99.999%) 2-8mm;Copper metal foil;Copper turnings;Copper metal wire;Copper solution 1000 ppm;Copper solution 10 000 ppm;Electrolytic copper;Sponge copper;Copper nanopowder;copper(2+);
      		 
      		
      		
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Molecular Formula:
      			Cu
      		 
      		
  				
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Molecular Weight:
      			63.5449
      		 
      		
      		
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Molecular Structure:
    				
	    				
	    					
	    				
	     				
   					    
  				 
  				
  				
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Hazard Symbols:
    				
 F:Flammable;
  				 
 				 	  
				      
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Risk Codes:
    				R11:;
  				 
  				  
				    
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Safety Description:
				    S16:;
				   
				   
      	
       
      
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