Diamond Dicing Blades
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Post Date:
Aug 14,2017
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Expiry Date:
Aug 14,2018
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Detailed Description:
Quantity: 20FCL
Payment Method: T/T, Western Union, MoneyGram, PayPal,etc
Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.
The Type: diamond hub dicing blade and diamond hubless dicing blade
1.Electroformed dicing blade
The Type: diamond hub dicing blade and diamond hubless dicing blade
Electroformed dicing blade
Features: Easy to handle ultra-thin blade; Blade dicing after laser grooving; Variety of different grit concentrations; Shows stable processing
performance in high load processing
Hub dicing blade
Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)
resin dicing blade
Features: High processing quality for cutting of hard, brittle materiais; Able to precisely control diamond concentration to achieve cutting quality; Improved cut quality on hard materials
metal dicing balde
Features: High rigidityminimized wavy and slant cuttig,
Able to control diamond concentration to achieve cutting quality ;Excellent rigidit and cut quality
Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP,
Electroformed dicing balde
Features:
Wide selection of blade options; Proprietary
thin-blade technology ;Blade thickness - 0.0
15 mm to 0.3 mm; Available for both dicing
saws and slicers
Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
Other specification can be produced according to customer’s requirements
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